IEEE EPEC 2019
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  • Program
    • Program Overview
    • Plenary Sessions
    • Technical Sessions
    • Workshops
    • Industry Sessions
    • WIE Panel
  • Call for Papers
  • Submission Guide
  • Registration
  • Venue
  • History

Program Overview

To view the table below in a PDF format, click here.

For the detailed program, click here to view on EDAS or click here to download as PDF.

Note: Some of the sessions labeled “HQ Session” may not be open to all.

Plenary Sessions

Technical Sessions

Workshops

Industry Sessions

WIE Panel

IMPORTANT INFORMATION

Conference dates:
     October 16 to 18, 2019

Conference location:
     Montréal, QC, Canada

Paper submission deadline:
     May 20, 2019

Acceptance/rejection notification:
     July 15, 2019

Submission of camera-ready papers:
     August 30, 2019

Platinum Sponsor

McGill University

Silver Sponsor

Event Conduct & Safety Statement

IEEE believes that science, technology, and engineering are fundamental human activities, for which openness, international collaboration, and the free flow of talent and ideas are essential. Its meetings, conferences, and other events seek to enable engaging, thoughtprovoking conversations that support IEEE’s core mission of advancing technology for humanity. Accordingly, IEEE is committed to providing a safe, productive, and welcoming environment to all participants, including staff and vendors, at IEEE-related events.

IEEE has no tolerance for discrimination, harassment, or bullying in any form at IEEE-related events. All participants have the right to pursue shared interests without harassment or discrimination in an environment that supports diversity and inclusion. Participants are expected to adhere to these principles and respect the rights of others.

IEEE seeks to provide a secure environment at its events. Participants should report any behavior inconsistent with the principles outlined here, to on site staff, security or venue personnel, or to eventconduct@ieee.org.

Platinum Sponsor

McGill University

Silver Sponsor

In Collaboration with

EPEC Editions

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